JPH0192142U - - Google Patents
Info
- Publication number
- JPH0192142U JPH0192142U JP18678587U JP18678587U JPH0192142U JP H0192142 U JPH0192142 U JP H0192142U JP 18678587 U JP18678587 U JP 18678587U JP 18678587 U JP18678587 U JP 18678587U JP H0192142 U JPH0192142 U JP H0192142U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- semiconductor element
- dissipation plate
- plate
- pressing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18678587U JPH0192142U (en]) | 1987-12-08 | 1987-12-08 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18678587U JPH0192142U (en]) | 1987-12-08 | 1987-12-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0192142U true JPH0192142U (en]) | 1989-06-16 |
Family
ID=31477993
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18678587U Pending JPH0192142U (en]) | 1987-12-08 | 1987-12-08 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0192142U (en]) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0518039U (ja) * | 1991-08-12 | 1993-03-05 | 株式会社ケンウツド | 半導体押え金具 |
-
1987
- 1987-12-08 JP JP18678587U patent/JPH0192142U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0518039U (ja) * | 1991-08-12 | 1993-03-05 | 株式会社ケンウツド | 半導体押え金具 |